AS4C32M16D3L-12BINTR

Product Overview

Category

AS4C32M16D3L-12BINTR belongs to the category of computer memory modules.

Use

It is used as a Random Access Memory (RAM) module in various electronic devices, such as computers, servers, and embedded systems.

Characteristics

• Capacity: 32 Megabytes (MB)
• Type: DDR3 SDRAM
• Speed: 1200 MHz
• Organization: 32M words x 16 bits
• Voltage: 1.5V
• Package: BGA (Ball Grid Array)
• Temperature Range: Industrial (-40°C to +85°C)

Packaging/Quantity

The AS4C32M16D3L-12BINTR memory module is typically packaged in trays or reels. The quantity per package depends on the manufacturer's specifications and customer requirements.

Specifications

• Part Number: AS4C32M16D3L-12BINTR
• Memory Type: DDR3 SDRAM
• Memory Size: 32MB
• Data Rate: 1200 Mbps
• Interface: 240-pin DIMM
• CAS Latency: 12
• Operating Voltage: 1.5V
• Refresh: Auto-refresh and self-refresh modes supported
• Error Correction: Non-ECC

Detailed Pin Configuration

The AS4C32M16D3L-12BINTR memory module has a 240-pin DIMM interface. The pin configuration is as follows:

| Pin Number | Pin Name | Description | |------------|----------|-------------| | 1 | VDD | Power Supply Voltage | | 2 | DQ0 | Data Input/Output Bit 0 | | 3 | DQ1 | Data Input/Output Bit 1 | | ... | ... | ... | | 240 | VSS | Ground |

Functional Features

• High-speed data transfer rate for improved system performance.
• Low power consumption for energy efficiency.
• Wide temperature range for reliable operation in various environments.
• Auto-refresh and self-refresh modes for memory integrity.
• Non-ECC error correction for cost-effective applications.

Advantages

• Provides fast and efficient data access, enhancing overall system performance.
• Low power consumption helps reduce energy costs and prolong battery life in portable devices.
• Wide temperature range allows for reliable operation in harsh industrial environments.
• Auto-refresh and self-refresh modes ensure data integrity during extended periods of inactivity.
• Non-ECC error correction provides a cost-effective solution for applications that do not require high-level data reliability.

Disadvantages

• Limited capacity compared to higher-end memory modules.
• DDR3 technology may be outdated for some advanced computing applications.
• Not suitable for applications requiring error-correcting capabilities.

Working Principles

The AS4C32M16D3L-12BINTR memory module works based on DDR3 SDRAM technology. It stores data in an array of capacitors, which are organized into rows and columns. The data is accessed by sending read or write commands along with the appropriate row and column addresses. The memory controller manages the timing and synchronization of these operations.

Detailed Application Field Plans

The AS4C32M16D3L-12BINTR memory module can be used in various applications, including: 1. Desktop computers 2. Laptop computers 3. Servers 4. Workstations 5. Networking equipment 6. Industrial control systems 7. Embedded systems

Detailed and Complete Alternative Models

Some alternative models to AS4C32M16D3L-12BINTR include: 1. AS4C64M16D3L-12BINTR: 64MB DDR3 SDRAM memory module with similar specifications. 2. AS8C32M16D3L-12BINTR: 32MB DDR3 SDRAM memory module with extended temperature range. 3. AS4C32M16D3L-12BINTS: 32MB DDR3 SDRAM memory module in a different package.

In conclusion, the AS4C32M16D3L-12BINTR is a DDR3 SDRAM memory module with a capacity of 32MB. It offers high-speed data transfer, low power consumption, and wide temperature range. While it has limitations in terms of capacity and error correction, it is suitable for various applications in desktops, laptops, servers, and embedded systems. Alternative models with different specifications are also available in the market.