GD25LQ64CSIGR

Product Overview

Category

GD25LQ64CSIGR belongs to the category of flash memory chips.

Use

This product is primarily used for data storage in various electronic devices such as smartphones, tablets, digital cameras, and other consumer electronics.

Characteristics

• Non-volatile memory: The data stored in GD25LQ64CSIGR is retained even when power is turned off.
• High capacity: This chip has a storage capacity of 64 megabits (8 megabytes).
• Fast read and write speeds: GD25LQ64CSIGR offers high-speed data transfer, allowing for quick access to stored information.
• Low power consumption: It is designed to operate efficiently with minimal power consumption.
• Compact package: The chip is packaged in a small form factor, making it suitable for integration into compact electronic devices.

Package and Quantity

GD25LQ64CSIGR is typically packaged in a surface-mount device (SMD) package. The exact package type may vary depending on the manufacturer. It is commonly available in reels or trays containing multiple units.

Specifications

• Memory Capacity: 64 megabits (8 megabytes)
• Interface: Serial Peripheral Interface (SPI)
• Supply Voltage: 2.7V - 3.6V
• Operating Temperature Range: -40°C to +85°C
• Data Retention: Up to 20 years
• Erase/Program Cycles: Up to 100,000 cycles

Pin Configuration

The GD25LQ64CSIGR chip has a total of 8 pins arranged as follows:

┌───┬───┐ │ 1 │ 2 │ ├───┼───┤ │ 3 │ 4 │ ├───┼───┤ │ 5 │ 6 │ ├───┼───┤ │ 7 │ 8 │ └───┴───┘

1. Chip Select (CS)
2. Serial Clock (SCLK)
3. Serial Data Input/Output (SDIO)
4. Ground (GND)
5. Not Connected (NC)
6. Supply Voltage (VCC)
7. Hold (HOLD)
8. Write Protect (WP)

Functional Features

• High-speed data transfer: GD25LQ64CSIGR supports fast read and write operations, enabling efficient data access.
• Flexible erase and program operations: The chip allows for sector-level or full-chip erasure and programming, providing flexibility in managing data.
• Hardware and software protection mechanisms: GD25LQ64CSIGR incorporates various security features to protect stored data from unauthorized access or modification.
• Error correction codes (ECC): This chip employs ECC algorithms to ensure data integrity and reliability.

Advantages and Disadvantages

Advantages

• High storage capacity
• Fast data transfer speeds
• Low power consumption
• Compact form factor
• Reliable data retention

Disadvantages

• Limited erase and program cycles
• Relatively higher cost compared to other memory technologies

Working Principles

GD25LQ64CSIGR utilizes the Serial Peripheral Interface (SPI) protocol to communicate with the host device. It stores data in non-volatile memory cells that can be electrically erased and programmed. The SPI interface enables the host device to read, write, erase, and manage data stored in the chip.

Application Field Plans

GD25LQ64CSIGR finds applications in a wide range of electronic devices, including: - Smartphones and tablets - Digital cameras - Portable media players - Automotive electronics - Industrial control systems - IoT devices

Alternative Models

Some alternative models to GD25LQ64CSIGR include: - W25Q64JVZPIQ (Winbond) - S25FL064LABMFI011 (Cypress Semiconductor) - MX25L6433FM2I-08G (Macronix)

These models offer similar specifications and functionality, providing options for designers and manufacturers in selecting suitable flash memory chips.

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