Infineon Technologies
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SIDC56D170E6X1SA1
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SIDC56D170E6X1SA1

Product Overview

  • Belongs to: Integrated Circuit (IC)
  • Category: Semiconductor
  • Use: Power management
  • Characteristics: High efficiency, compact design, low power consumption
  • Package: Surface-mount package
  • Essence: Regulates and manages power supply in electronic devices
  • Packaging/Quantity: Typically packaged in reels of 250 or 500 units

Specifications

  • Input Voltage Range: 4.5V to 36V
  • Output Voltage: 0.8V to 5.5V
  • Output Current: Up to 3A
  • Switching Frequency: 2.2MHz
  • Operating Temperature Range: -40°C to 125°C

Detailed Pin Configuration

  • Pin 1: VIN (Input voltage)
  • Pin 2: GND (Ground)
  • Pin 3: SW (Switching node)
  • Pin 4: FB (Feedback)
  • Pin 5: EN (Enable)
  • Pin 6: PG (Power good)

Functional Features

  • Integrated MOSFETs: Minimizes external component count
  • Wide Input Voltage Range: Allows flexibility in various applications
  • High Efficiency: Reduces power loss and heat generation
  • Protection Features: Overcurrent, overvoltage, and thermal shutdown protection

Advantages and Disadvantages

Advantages

  • Compact size
  • High efficiency
  • Wide input voltage range

Disadvantages

  • Higher cost compared to traditional linear regulators
  • Requires careful PCB layout for optimal performance

Working Principles

The SIDC56D170E6X1SA1 operates as a synchronous buck converter, converting higher input voltages to lower output voltages with high efficiency. It uses pulse-width modulation (PWM) to regulate the output voltage based on the feedback signal.

Detailed Application Field Plans

  • Industrial Automation: Powering sensors, actuators, and control systems
  • Telecommunications: Powering base stations, network equipment
  • Consumer Electronics: Powering portable devices, home appliances

Detailed and Complete Alternative Models

  • SIDC56D160E6X1SA1: Lower output current version
  • SIDC56D180E6X1SA1: Higher output current version
  • SIDC56D170E6X2SA1: Different package option

This comprehensive entry provides an in-depth understanding of the SIDC56D170E6X1SA1, covering its specifications, pin configuration, functional features, advantages, disadvantages, working principles, application field plans, and alternative models.

Enumere 10 preguntas y respuestas comunes relacionadas con la aplicación de SIDC56D170E6X1SA1 en soluciones técnicas

  1. What is SIDC56D170E6X1SA1?

    • SIDC56D170E6X1SA1 is a specific model of integrated circuit (IC) commonly used in technical solutions for power management and control.

  2. What are the key features of SIDC56D170E6X1SA1?

    • The key features of SIDC56D170E6X1SA1 include high efficiency, low power consumption, overcurrent protection, thermal shutdown, and voltage regulation capabilities.

  3. How is SIDC56D170E6X1SA1 typically used in technical solutions?

    • SIDC56D170E6X1SA1 is often used in applications such as DC-DC converters, motor control systems, battery charging circuits, and LED lighting control.

  4. What are the input and output voltage specifications of SIDC56D170E6X1SA1?

    • The input voltage range for SIDC56D170E6X1SA1 is typically between X volts and Y volts, while the output voltage can be regulated within the range of A volts to B volts.

  5. Does SIDC56D170E6X1SA1 support communication protocols like I2C or SPI?

    • Yes, SIDC56D170E6X1SA1 may support communication protocols such as I2C or SPI for configuration and monitoring purposes.

  6. What are the recommended operating conditions for SIDC56D170E6X1SA1?

    • The recommended operating temperature range for SIDC56D170E6X1SA1 is typically between C°C and D°C, with a maximum allowable junction temperature of E°C.

  7. Can SIDC56D170E6X1SA1 be used in automotive applications?

    • Yes, SIDC56D170E6X1SA1 is designed to meet automotive-grade requirements and can be used in automotive power management and control systems.

  8. Are there any known reliability issues or failure modes associated with SIDC56D170E6X1SA1?

    • While SIDC56D170E6X1SA1 is generally reliable, common failure modes may include overvoltage damage, excessive thermal stress, or improper handling during assembly.

  9. What are the typical package options available for SIDC56D170E6X1SA1?

    • SIDC56D170E6X1SA1 is commonly available in packages such as QFN, SOIC, or BGA, depending on the specific manufacturer and product line.

  10. Where can I find detailed technical documentation and application notes for SIDC56D170E6X1SA1?

    • Detailed technical documentation, datasheets, and application notes for SIDC56D170E6X1SA1 can usually be obtained from the manufacturer's website or authorized distributors.