Memory chip

Número de pieza
MICROCHIP (US Microchip)
Fabricantes
Descripción
50544 PCS
En stock
Número de pieza
MICROCHIP (US Microchip)
Fabricantes
Descripción
79350 PCS
En stock
Número de pieza
GigaDevice (GigaDevice Innovation)
Fabricantes
Descripción
95778 PCS
En stock
Número de pieza
ISSI (American core into)
Fabricantes
Descripción
53696 PCS
En stock
Número de pieza
MICROCHIP (US Microchip)
Fabricantes
Descripción
88712 PCS
En stock
Número de pieza
CYPRESS (Cypress)
Fabricantes
Descripción
65059 PCS
En stock
Número de pieza
ST (STMicroelectronics)
Fabricantes
Descripción
87672 PCS
En stock
Número de pieza
ICMAX (Hong Wang)
Fabricantes
Descripción
62437 PCS
En stock
Número de pieza
FMD (Hui Mang Micro)
Fabricantes
Descripción
79506 PCS
En stock
Número de pieza
WINBOND (Winbond)
Fabricantes
Descripción
83325 PCS
En stock
Número de pieza
MICROCHIP (US Microchip)
Fabricantes
Descripción
95844 PCS
En stock
Número de pieza
CYPRESS (Cypress)
Fabricantes
Descripción
53863 PCS
En stock
Número de pieza
micron
Fabricantes
1-Gbit(128M x 8bit), parallel interface, working voltage: 2.7V to 3.6V
Descripción
87415 PCS
En stock
Número de pieza
MICROCHIP (US Microchip)
Fabricantes
Descripción
82927 PCS
En stock
Número de pieza
HGSEMI (Huaguan)
Fabricantes
2.7-5.0V
Descripción
82037 PCS
En stock
Número de pieza
ST (STMicroelectronics)
Fabricantes
Descripción
97078 PCS
En stock
Número de pieza
MICROCHIP (US Microchip)
Fabricantes
Descripción
54788 PCS
En stock
Número de pieza
MICROCHIP (US Microchip)
Fabricantes
Descripción
69188 PCS
En stock
Número de pieza
CYPRESS (Cypress)
Fabricantes
Descripción
83439 PCS
En stock
Número de pieza
CS (Creation)
Fabricantes
SD NAND second generation, driver-free, standard SDIO interface, compatible with SPI/SD/eMMC interface, compatible with major MCU platforms; built-in EDC/ECC, bad block management, garbage collection algorithm; can be machine-mounted, lock wafer and controller , High consistency; built-in SLC wafer, 10W erasing and writing life, passed 10,000 random power-off tests, and supports industrial-grade temperature -40°~+85°. CS (Creation) SD NAND is also called by many developers and friends: SMD TF card, SMD SD card, SMD card, soldered SD card, soldered TF card, industrial-grade TF card, industrial-grade SD card, embedded SD card, etc. It mainly solves the problem that the main control (such as STM32 series MCU MCU) needs to manage NAND FLASH by itself when using SLC NAND FLASH, SPI NAND FLASH, eMMC, etc. CS (Genesis) SD NAND can be used without drivers (so it is also called no need to write drivers NAND Flash). Compared with eMMC, CS (Genesis) SD NAND has fewer pins (convenient for soldering); smaller capacity (can help customers reduce costs); longer erasing life; smaller size (occupies only 1/3 of eMMC PCB area) ); save the number of PCB board layers (2-layer board can be used)
Descripción
66033 PCS
En stock